| abstract |
The present invention provides a method for manufacturing a film, which includes a process for applying a slit to a member using a composition. The member contains metal at least in a part of the member. The composition contains: a polyimide precursor; At least two solvents having different solubility at 23 ° C. of the imine precursor; and at least one selected from the group consisting of a surfactant and a plasticizer. Furthermore, this invention relates to the manufacturing method of the laminated body related to the manufacturing method of this film, the manufacturing method of a semiconductor device, and the composition for film formation. |