patent/TW-201937584-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201937584-A

Outgoing Links

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filingDate	2019-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a2b8a8f381ab61be70cab39dfb5ebac http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_77ab0a85567552834adb9abfa2c48094 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4f0c90459f32088082dec0d5116c7f8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6eee3ae1daa1e9cfa39fa60fe62cbf3
publicationDate	2019-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	TW-201937584-A
titleOfInvention	Technology for processing devices
abstract	Representative techniques of the present invention provide process steps for forming microelectronic assemblies that include preparing microelectronic components for bonding, such as dies, wafers, substrates, and the like. One or more surfaces of these microelectronic components are formed and prepared as bonding surfaces. The microelectronic components are stacked and bonded without adhesive at the prepared bonding surfaces.
priorityDate	2018-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID450502002 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID25516

Total number of triples: 67.