http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201936996-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02074 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02063 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02068 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32134 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02087 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3213 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23G1-02 |
| filingDate | 2019-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd95339f6533a61c8e7f94acde46b4a6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9545efccb44a548b9b6194cde627ba1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5117df5323734ea44e6f5d31d94aca51 |
| publicationDate | 2019-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201936996-A |
| titleOfInvention | Substrate processing method, semiconductor device manufacturing method, and substrate processing kit |
| abstract | The present invention provides a processing method capable of suppressing the residual ruthenium on the surface of a substrate after the treatment and capable of efficiently removing the substrate of the transition metal-containing material on the substrate. Moreover, a method of manufacturing a semiconductor device including the above-described substrate processing method and a substrate processing kit that can be applied to the substrate processing method are provided. The method for treating a substrate of the present invention includes a process A for using a substrate containing a transition metal-containing material, and using a ruthenium compound and one or more kinds of pH adjusters selected from the group consisting of nitric acid, perchloric acid, ammonia, and sulfuric acid. a chemical solution to remove the transition metal content on the substrate; and a process B, after the process A, using a solution selected from the group consisting of hydrogen peroxide, a hydrofluoric acid, a nitric acid, an aqueous perchloric acid solution, an aqueous oxalic acid solution, and One or more of the rinsing liquids in the group of the acidic aqueous solution other than the mixed aqueous solution and the acidic aqueous solution containing no hydrogen peroxide are subjected to rinsing treatment on the substrate obtained in the above process A. |
| priorityDate | 2018-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 75.