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publicationDate 2019-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201936888-A
titleOfInvention Method for applying a thermally conductive composition to an electronic component
abstract The disclosed is a method for forming a thermally conductive composition on an electronic component in a simple and cost effective manner. The method comprises three steps: (I) preparing a polyfluorene oxide composition comprising (A) a polyorganosiloxane, (B) a thermally conductive filler, and (C) a catalyst; (II) The polyoxymethylene composition is applied to an electronic component of an electronic device that generates heat when the electronic device is in operation; and (III) solidifies the polyoxymethylene composition by heat generated by the electronic component.
priorityDate 2018-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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