| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_48de1cfdc993735cdc1c82f96827b33e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-2009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09018
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0129
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09263 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-70 |
| filingDate |
2019-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b0c731d7610c9b262447a0379dbfda7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_18fc855ec9a4241ca1ea9e6281fa6a5c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e9a0ea20d0337676142fd18e2aa579f |
| publicationDate |
2019-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201936034-A |
| titleOfInvention |
Technology for thermoforming electronic devices having surface curvature |
| abstract |
A method for manufacturing a curved electronic device and the resulting product. A patterned layer of a non-conductive support material is printed on a thermoplastic substrate to form a support pattern. A circuit is applied to the support pattern, wherein the circuit includes circuit lines and electrical components applied to the support island body of the pattern, and the circuit lines include a conductive material applied to the support lines of the pattern. A thermoforming process is used to deform the substrate while a relatively high resistance to deformation of the support material maintains a structural integrity of the circuit. |
| priorityDate |
2018-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |