| abstract |
The invention discloses a halogen-free epoxy resin composition, a laminated board and a printed circuit board. The halogen-free epoxy resin composition includes 100 parts by weight of a halogen-free naphthalene-type epoxy resin, 10 to 25 parts by weight of a DOPO modified hardener, 25 to 45 parts by weight of a cyanate resin, and 35 to 60 parts by weight of a double Maleimide, 45 to 65 parts by weight of a non-DOPO flame retardant, and 0.5 to 15 parts by weight of a hardening accelerator. The halogen-free epoxy resin composition of the present invention can provide a halogen-free epoxy resin composition, so the halogen-free epoxy resin composition can have high glass transition temperature, low dielectric constant, low dielectric loss, and high heat resistance And high storage modulus. |