| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a8a9982b1666c54b5bf02d6c944891e4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F226-04 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C23-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03B33-0222
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C15-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C15-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C25-68 |
| filingDate |
2018-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ed0f14fa883833861d1eae385ffc016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ddb6e90673f0ba3af106dcf852226750
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_54d08e6b23400cc54945bd01fbb3dbe9 |
| publicationDate |
2019-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201930222-A |
| titleOfInvention |
Method of etching via holes in a glass substrate using positively charged organic molecules |
| abstract |
The present invention discloses a method of forming via holes in a glass substrate article by a laser damage and etching process including an etching solution having positively charged organic molecules. In some embodiments, a method of forming a via in a glass substrate article includes forming a damaged trace through a block of the glass substrate article extending from a first surface of the glass substrate article to the glass a second surface of one of the substrate members; and applying an etching solution to the glass substrate article to form the through hole. The etching solution includes at least one acid and a positively charged organic molecule. An etch rate at one of the first surface and the second surface is lower than an etch rate at the damaged trace. |
| priorityDate |
2017-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |