| abstract |
The present invention provides a hexagonal boron nitride (h-BN) powder that can improve the thermal conductivity and withstand voltage (insulation breakdown voltage) of the resin and the like when used as a filler for insulating heat dissipation materials such as resin and a method for manufacturing the same And a composition using the aforementioned h-BN powder and a heat dissipation material excellent in heat dissipation and insulation. For the average primary particle size, 50% volume cumulative particle size D 50 , BET specific surface area and bulk density within the specified range, the peak A and particle size 20.0 within the range of particle size distribution curve particle size 1.0 μm or more and less than 20.0 μm The peak B of the range of more than μm and less than 200.0 μm is a h-BN powder containing primary particle agglomerates of h-BN. The primary particle agglomeration system of the h-BN uses the h-BN powder under specified conditions. During the 3-minute ultrasound treatment, the ratio of the height a1 of the peak A before the treatment to the height b1 of the peak B (a1 / b1), and the ratio of the height a2 of the peak A after treatment to the height b2 of the peak B (a2 / b2 ) Is within the specified range. |