| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c06f5570964f6c9cc49939ee17013ca3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-133325
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F2201-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F2202-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D1-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-13338
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-133311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04M1-0266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-1303
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04M1-185 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F1-1656
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-133308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F1-1637
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-1303 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 |
| filingDate |
2018-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_49704f805b3bcc8d560746d08bc26d71
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b78e3806ff2e8bc6a8b5eedd58a9bcd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e268fe7d540e045b80fd978322b9c73
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12962b41c8dee7c7006736b6b081e839
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2627fc9572d483bc9b4871bb816c53ba |
| publicationDate |
2019-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201927108-A |
| titleOfInvention |
Method of modifying the surface of an electrical or electronic device |
| abstract |
The present invention provides a method of modifying the surface of an electrical or electronic device. The method has the steps of: placing the electrical or electronic device in a processing chamber; reducing pressure in the processing chamber; applying a surface modification process within the processing chamber; wherein the electrical or electronic device includes a screen, the screen Including a first layer and a second layer separated by an air gap, and a venting opening that provides fluid communication between the air gap of the electrical or electronic device and the exterior such that a reduction in pressure in the processing chamber results in the The reduction in pressure in the air gap. |
| priorityDate |
2017-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |