| abstract |
The invention relates to a chemical mechanical polishing composition for polishing a substrate having a tungsten layer, which includes a water-based liquid carrier, abrasive particles dispersed in the liquid carrier, an iron-containing accelerator, and an amino acid monomer. Cationic polymer. A method of chemical mechanical polishing a substrate including a tungsten layer, comprising contacting the substrate with the polishing composition, moving the polishing composition relative to the substrate, and grinding the substrate to remove a portion of the tungsten from the substrate and thereby The substrate is polished. |