| abstract |
The invention provides a method for manufacturing a semiconductor device, which includes: providing a semiconductor device substrate having a relief image on a surface of the substrate, the relief image having a plurality of gaps to be filled; and applying a coating composition to the substrate. The relief image is provided to provide a coating, wherein the coating composition comprises (i) a polyarylidene oligomer comprising one or more first monomers having two or more cyclopentadienone moieties As a polymerization unit, and one or more second monomers having an aromatic moiety and two or more alkynyl moieties; wherein the polyarylidene oligomer has a M w of 1,000 to 6000 Da, 1 to PDI of 2 and a molar ratio of total first monomer to total second monomer of 1:>1; and (ii) one or more organic solvents; curing the coating to form a polyarylate film; Patterning the polyarylate film; and transferring the pattern to the semiconductor device substrate. |