http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201920515-A

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filingDate 2018-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51b040a0ebad7709ad3a840db588f6ef
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publicationDate 2019-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201920515-A
titleOfInvention Copper ink
abstract The copper-based ink contains copper hydroxide and diethanolamine. The ink can be applied to the substrate and decomposed on the substrate to form a conductive copper coating on the substrate. Ink costs are low, and micron-thick ink traces can be screen-printed and thermally sintered in the presence of up to about 500 ppm of oxygen or photo-sintered in air to produce highly conductive copper features. Compared to traces made from other copper inks, sintered copper traces made from this ink have improved air stability. For screen printing lines with a width of 5-20 mils, sintered copper traces with a sheet resistivity of about 20 milliohms / □ / mil or less can be obtained with excellent resolution.
priorityDate 2017-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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