| abstract |
An object of the present invention is to provide a resin composition having high strength, low warpage, and excellent adhesion, a high-strength resin film formed by thinning the composition, a semiconductor laminate having a cured product of the resin film, and a method for producing the same. And a semiconductor device formed by singulating the semiconductor laminate and a method for manufacturing the same. The solution to the present invention is a resin composition comprising (A) an epoxy resin, (B) an epoxy compound described by the following formula (1) and / or formula (2), and (C) the following An epoxy compound represented by formula (3), (D) a phenolic hardener, and (E) a hardening accelerator. (Where A is a single bond or is selected from the following formula (Divalent organic group). |