| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3146812a1c085624a65b46fae27d81d3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2237-343
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2237-124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2237-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-3298
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2237-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2237-407 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B37-026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C8-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C8-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C3-066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C3-091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B37-025 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B37-02 |
| filingDate |
2018-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17f44d998db1c51323c517f172c42218
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac390731d9e28583b64ba4f2abee9580
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eaf1f017d4aa44bc8db1fbb7bb18654a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d19a0631699df09573efe5fba154995
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cba8154a17bfcf988318bb4a15fea0a1 |
| publicationDate |
2019-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201920050-A |
| titleOfInvention |
Thick film plastic dielectric ceramic connecting metal or metal mixed foil and through hole |
| abstract |
The invention describes a method for preparing a ceramic substrate connected to a metal foil. In addition, a metal-ceramic substrate provided with a thick film layer and a use of a thick film adhesive for connecting a metal foil to a ceramic substrate are described. The metal-ceramic substrate according to the present invention is provided with at least one vertical through hole (via hole) in the ceramic in order to allow circuit interconnection. |
| priorityDate |
2017-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |