| abstract |
A die stack structure includes a first die, a second die, a first bonding structure, and a second bonding structure. The first bonding structure is disposed on a back surface of the first die. The second bonding structure is disposed on a front surface of the second die. A surface of the first bonding structure where the first crystal grain and the second crystal grain are bonded together by the first bonding structure and the second bonding structure, and are bonded to the second bonding structure; The changeable topological range is less than 1 mm / 1 mm. A method of making a die stack structure is also provided. |