| abstract |
A package structure includes at least one semiconductor wafer, an insulating encapsulant, and a redistribution line structure. The semiconductor wafer has an active surface and a plurality of connection pads distributed over the active surface. The insulating encapsulant encapsulates the semiconductor wafer. The redistribution line structure is disposed on the semiconductor wafer and has at least one metallization layer, the at least one metallization layer having a plurality of metal segments, wherein the redistribution line structure is transmitted through the at least one metallization layer and the at least one metal A plurality of connection pads electrically connected to the layer are electrically connected to the semiconductor wafer. In a vertical projection on the active surface of the semiconductor wafer, a projected position of the first gap between any two of the plurality of connection pads and any two of the plurality of metal segments of the at least one metallization layer The projected positions of the second gaps between the nearest metal segments partially overlap. |