http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201919102-A

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filingDate 2018-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ece645e5c00f29ff233f5cf310629873
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publicationDate 2019-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201919102-A
titleOfInvention Semiconductor device manufacturing apparatus and semiconductor device manufacturing method
abstract The present invention provides a semiconductor device manufacturing apparatus and a semiconductor device manufacturing method which have an effective electrostatic removal effect, are excellent in cleanliness, and are excellent in chemical resistance.n n n The device for manufacturing a semiconductor device of the present invention comprises: a holder having a chuck pin and/or a wafer pin to hold the semiconductor wafer; and a nozzle for supplying a cleaning liquid, an etching liquid or a resist liquid; The manufacturing device of the device, wherein the nozzle comprises a resin molded body of a composite resin material containing at least one fluororesin and a carbon nanotube; and/or selected from the group consisting of a pin, a wafer pin, and a seat At least one of them is a resin molded body comprising a composite resin material containing at least one type of fluororesin and a carbon nanotube.
priorityDate 2017-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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