http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201918314-A

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filingDate 2017-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2019-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201918314-A
titleOfInvention Fitting method, substrate device, micro flow channel device and bonding method thereof
abstract A bonding method includes the following steps: providing two substrates, each of which includes a contact surface, and the contact surface of at least one substrate has a functional area; and the surface of each substrate is subjected to surface modification under the treatment of an energy source. Into a modified surface; bringing the modified surfaces into contact with each other to bond the substrates together; and irradiating a portion of the substrate on the edge of the functional area with a laser beam, so that the substrates are irradiated with laser light The parts are welded together. The substrate device prepared by the bonding method of the present invention is not easy to be separated by the substrate due to bending by external force, and can prevent water and gas from invading.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I730469-B
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