http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201917233-A

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filingDate 2018-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9bc0f3a768cdfe1cc0de412c6d38a37c
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publicationDate 2019-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201917233-A
titleOfInvention Method for manufacturing semiconductor device and method for forming metal oxide film
abstract [Problem] A method for forming a metal oxide film capable of forming a positive metal oxide film under low-temperature conditions and a method for producing a semiconductor device using the same are provided. [Means for Solving] A method of manufacturing a semiconductor device having a metal oxide film, which is performed in a state in which a processed object is housed in a chamber, and includes: a process of supplying a precursor gas containing a metal complex to a chamber Forming a precursor layer from the precursor gas on the object to be processed; engineering the supply of the oxidizing gas to the chamber, the oxidizing gas is a gas containing H 2 O, or the metal complex has a functional group containing a hydrogen atom, and the oxidizing gas is a gas comprising an oxidizing agent which reacts with the functional group to form H 2 O, wherein the precursor layer is oxidized to form a metal oxide layer by the oxidizing gas; and the chamber is supplied with an H 2 O gas removal process comprising an alcohol or an amine, to remove adsorbed on the metal oxide layer 2 O H 2 O is removed from the gas to the H; each precursor gas comprises supplying engineering project and the oxidizing gas supply performed multiple times cycles; at least a portion of the cycle into a plurality of times Contains engineering to supply H 2 O to remove gases.
priorityDate 2017-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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