| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-30 |
| filingDate |
2018-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c394019ec9a3b1af8f2020d27870795f |
| publicationDate |
2019-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201917189-A |
| titleOfInvention |
Adhesive composition, adhesive tape, and method of protecting semiconductor device |
| abstract |
An object of the present invention is to provide an adhesive composition having a high adhesive force and capable of peeling while suppressing the residue of a paste, an adhesive tape having an adhesive layer composed of the adhesive composition, and using the adhesive Agent composition or method for protecting semiconductor device of the adhesive tape. The invention is an adhesive composition, which contains a cross-linked adhesive polymer composed of an adhesive polymer and a cross-linking agent, and has a gel swelling ratio of 500% or more and a gel fraction of 87% or more. |
| priorityDate |
2017-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |