| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 |
| filingDate |
2018-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_64b9001d74dffb85dc50f6e99a69cd52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_adc3c98a2e18af37f47f0bdb0e38dc27 |
| publicationDate |
2019-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201915216-A |
| titleOfInvention |
Stable electroless copper plating composition and method for electroless copper plating on a substrate |
| abstract |
The selected carboxymethylthio compound is added to the electroless copper plating composition to improve the stability of the electroless copper plating composition, so that the chemistry is performed even at a low plating temperature and a high stabilizer concentration and a high leaching catalyst concentration. During plating, the plating activity of the electroless copper plating composition is not impaired. |
| priorityDate |
2017-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |