| abstract |
An object of the present invention is to provide a semiconductor device that suppresses peeling between a stamper resin and a substrate. The semiconductor device (1) is a semiconductor device (1) including a semiconductor wafer (20) and a substrate (10) molded by a stamper resin layer (40), and is characterized in that: a hardened stamper resin layer (40) ) And the substrate (10), there is a resin layer (50) with a thickness of 200 nm or less different from that of the stamper resin layer (40). When the length of the entire periphery of the wafer is 100%, the resin layer (50) existing between the stamper resin layer (40) and the substrate (10) is preferably present at more than 30% of the periphery. |