http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201912739-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_11d738aa9b5b691f2f5094e7b819ac93 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 |
| filingDate | 2018-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7174605ac9a137b675cdd5c685a0bb7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_92f9aea39f1f43f2d5a903a8292916ae |
| publicationDate | 2019-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201912739-A |
| titleOfInvention | Metal chemical mechanical planarization (CMP) composition and method therefor |
| abstract | The present invention provides a chemical mechanical planarization (CMP) formulation that provides high and adjustable Cu removal rates and low copper surface depressions for copper or through silicon vias (TSVs) for wide or advanced nodes. The CMP composition provides high selectivity of Cu films to other barrier layers such as Ta, TaN, Ti, and TiN, and dielectric films such as TEOS, low-k, and ultra-low-k films. The CMP grinding formulation comprises water; an abrasive; a single chelator, a double chelator or a triple chelator; and a morpholine-based family compound as a Cu surface depression reducing agent. Additionally, the organic quaternary ammonium salt, corrosion inhibitor, oxidant, pH adjuster, and antimicrobial agent can be used in the formulation. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I801027-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I754376-B |
| priorityDate | 2017-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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