http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201911397-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aa0f2776bcc27d5099aa97f3212e1681 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-56 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-53 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-364 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-06 |
| filingDate | 2018-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7aa0c742c4481df40c96e435c3905bdb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b0a21baed43d7618372dfaf8dcfa7382 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d0c3eab02188b9ec5a7820250f9568b7 |
| publicationDate | 2019-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201911397-A |
| titleOfInvention | Method of processing a substrate |
| abstract | Method of processing a substrate. The invention relates to a method for processing a substrate, the substrate having a first surface and a second surface opposite to the first surface, wherein the substrate has a device region on the first surface, the device region having a plurality of dividing lines Separate multiple devices. The method includes the steps of applying a pulsed laser beam to a substrate having a thickness of 100 μm or more from one side of the first surface, wherein a focal point of the pulsed laser beam is positioned along from the first surface toward the first. When the direction of the two surfaces is spaced apart from the first surface, the pulsed laser beam is applied to the substrate at least at a plurality of positions along the respective dividing lines so as to form a plurality of modifications in the substrate along the respective dividing lines. Region; and grinding a second surface of the substrate after forming the modified region in the substrate to adjust the thickness of the substrate. Furthermore, the present invention relates to a method for processing such a substrate, in which a plasma is applied to a substrate after forming a modified region and / or a hole region in the substrate to form a partition along the substrate. Multiple grooves for line extension. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11424161-B2 |
| priorityDate | 2017-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.