http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201910559-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eec6cec04e090b04d16f1f2a37244b45 |
classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-46 |
filingDate | 2017-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7264697395d8bd1fd525b89294c2bf6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ef57d7bb3c44c86c61cb088066957a9f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ff3704bdb801b63373fdc94b5018087 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e937112c388583ed45c7be366299df7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a08d75f994c47ae082fa9c4f304be0fc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc87f854558a2353df0da39ae79c3d39 |
publicationDate | 2019-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | TW-201910559-A |
titleOfInvention | Copper-silver two-component metal plating liquid for semiconductor wires and plating method |
abstract | A copper-silver two-component metal plating liquid comprising: copper methanesulfonate, silver methanesulfonate, methanesulfonic acid, chloride ion and water. The invention further provides a plating method for forming a copper-silver two-component metal by using the electroplating liquid, the steps comprising: (a) contacting the copper-silver two-component metal plating liquid with a substrate; (b) applying a working voltage, controlling The voltage has a current density between 0.1 and 2 ASD and the substrate is electroplated. Thereby, the design of the electroplating liquid by the methanesulfonic acid and the methanesulfonate makes the plating solution have environmentally-friendly characteristics such as low poisoning hazard. And in the electroplating, with the adjustment of potential and current, a copper-silver two-component metal plating layer with a specific silver content is obtained. |
priorityDate | 2017-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 59.