http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201910386-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a52af89e67b7b044f04d055c573de211 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0313 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-022 |
| filingDate | 2018-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_edcfd89ca75658ff3ae44c6ae23ff740 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_677191890c4657d715a2ba6a5f55205d |
| publicationDate | 2019-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201910386-A |
| titleOfInvention | Photosensitive resin composition, dry film, cured product, printed wiring board, and semiconductor device |
| abstract | An object of the present invention is to provide a photosensitive resin composition, a dried film having a resin layer obtained from the composition, a cured product of the composition or a resin layer of the dried film, a printed wiring board having the cured object, and For semiconductor devices, the photosensitive resin composition is particularly thick on a metal-coated substrate with a thick photosensitive film (for example, 5 μm or more). Good people. The solution is a photosensitive resin composition, a dry film using the same, a cured product, a printed wiring board, and a semiconductor element. The photosensitive resin composition contains (A) a polybenzoxazole precursor and (B) a photosensitizer. (C) a thiol compound, and (D) a urea compound and a melamine-based compound. |
| priorityDate | 2017-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 146.