Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R11-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-00 |
filingDate |
2018-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_732ef69e4b2dc1ddf8b1ae41ba517986 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7cc2e8776ab44ad376f9a903dc4fa6e1 |
publicationDate |
2019-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-201908445-A |
titleOfInvention |
Conductive adhesive composition and bonded structure using the same |
abstract |
The present invention discloses a conductive adhesive composition comprising (A) conductive particles, (B) thermosetting resin, (C) flux active agent, and (D) curing catalyst. The conductive particles contain a metal having a melting point of 200 ° C or lower. The average particle diameter of the conductive particles is 0.01 μm to 10 μm. The flux active agent includes a compound having a hydroxyl group and a carboxyl group. The conductive adhesive composition is used to electrically connect the circuit board 2 and the electronic component 3 mounted on the circuit board 2. |
priorityDate |
2017-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |