| abstract |
A resist underlayer film forming composition characterized by comprising: (A) a compound represented by the following formula (1), and (B) a compound represented by the following formula (2-1) or the following formula (2-2) Represents cross-linkable compounds. (In formula (1), R 1 is independently a divalent radical having 1 to 30 carbon atoms, and R 2 to R 7 are each independently a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, C6-C10 aryl group, C2-C10 alkenyl group, thiol group or hydroxy group, at least one of R 5 is hydroxy or thiol group, m 2 , m 3 and m 6 are each independently 0 ~ Integer of 9, m 4 and m 7 are each independently an integer of 0 ~ 8, m 5 is an integer of 1 ~ 9, n is an integer of 0 ~ 4, and p 2 ~ p 7 are each independently an integer of 0 ~ 2). (In formula (2-1) and formula (2-2), Q 1 is a single bond or m 12- valent organic group, and R 12 and R 15 are each independently an alkyl group having 2 to 10 carbon atoms or a carbon number 1 The alkyl group of 2-10 carbon atoms of the alkoxy group of ~ 10, R 13 and R 16 are each independently a hydrogen atom or a methyl group, and R 14 and R 17 are each independently an alkyl group of 1-10 carbon atoms or 6 carbon atoms ~ 40 aryl. N 12 is an integer from 1 to 3, n 13 is an integer from 2 to 5, n 14 is an integer from 0 to 3, n 15 is an integer from 0 to 3, and these have 3 ≦ (n 12 + n 13 + n 14 + n 15 ) ≦ 6. n 16 is an integer from 1 to 3, n 17 is an integer from 1 to 4, n 18 is an integer from 0 to 3, n 19 is an integer from 0 to 3 , These have a relationship of 2 ≦ (n 16 + n 17 + n 18 + n 19 ) ≦ 5. M 12 is an integer of 2 ~ 10). |