| abstract |
Provide a tin-plated copper terminal material, a terminal formed by the terminal material, and a wire terminal structure using the terminal. The tin-plated copper terminal material has a base material, an intermediate zinc layer, and a tin layer, and effectively suppresses Galvanic corrosion. The substrate is made of copper or copper alloy. The intermediate zinc layer is formed on the aforementioned substrate. The intermediate zinc layer is formed of zinc alloy. The thickness is 0.10 μm or more and 5.00 μm or less. The tin layer is formed on the intermediate zinc layer. On the other hand, the ratio of the length occupied by the small inclination grain boundary to the length of the full grain boundary made of tin or a tin alloy is 2% or more and 30% or less. |