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filingDate 2018-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2019-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201907498-A
titleOfInvention Semiconductor device manufacturing method
abstract The present invention aims to improve the reliability of a semiconductor device. A method for manufacturing a semiconductor device according to the present invention includes: (a) preparing a semiconductor wafer having a pad electrode 4, a conductive layer 13 made of copper, a photoresist film PR1, and gold The conductive layer 15 is formed; (b) a protective film 18 made of iodine is formed on the surface of the conductive layer 15; (c) a photoresist film PR1 is removed; Removing the protective film 18; and step (e), bringing a part of the bonding wire into contact with the surface of the conductive layer 15.
priorityDate 2017-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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