| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_78c81eee3745be3f24f94e9de1686991 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0239
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3736 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3735
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 |
| filingDate |
2018-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_53e5208898672a04c211a71ab09c77e7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_327d644e56246ec1bab5bd5a5f5caf44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c33ad5c82aa51aae0bda0c7c215420e3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3603acd9ee7ec3930d0257ce652bc9bc |
| publicationDate |
2019-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201906723-A |
| titleOfInvention |
Method for manufacturing laminated body, electronic device, and laminated body |
| abstract |
The present invention provides a laminated body of an inorganic substance and a metal, and the laminated body is excellent in thermal conductivity and layer indirect adhesion. The multilayer body of the present application includes: a first thermally conductive inorganic filler bonded to one end of the first coupling agent 11; a metal layer bonded to one end of the third coupling agent; and the other end of the third coupling agent Bonded to the other end of the first coupling agent. By having a bond via an organic compound between the inorganic filler and the metal layer as described above, a laminated body having excellent thermal conductivity and indirect layer adhesion can be formed. |
| priorityDate |
2017-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |