| abstract |
The photosensitive resin composition of the present invention includes an alkali-soluble resin, a sensitizer, and a solvent, and the solvent includes a urea compound or an amidine compound having a non-cyclic structure. The structure of the urea compound is preferably an acyclic structure. Further, a urea compound-based tetramethylurea is preferred. In addition, the amidine compound having a non-cyclic structure is preferably 3-methoxy-N, N-dimethylpropanamide, for example. Further, an alkali-soluble resin-based polyamine resin is preferred. |