| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_154f5a8a983d88f296117dcc92946ab4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2310-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2043-106
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2463-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2043-3494
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B9-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B9-06 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4071
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B7-90
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C43-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B9-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B9-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-688
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C43-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C43-003 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2018-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_879d7f2c401bf716e164217140bcd432
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc6540efd394cd0c11eb9e190bc30d45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa5a8954ec4a64a8c41c706a1e421439
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3bd2d3fdba8056b5596ac71be2ddd318
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65b89db6034d59c4ef05fe3a9870b5cb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a11b57e3fbb005ee942b72d058d821a |
| publicationDate |
2019-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201905045-A |
| titleOfInvention |
In-situ epoxy resin composition for semiconductor package and semiconductor device using the same |
| abstract |
The invention discloses an ingot epoxy resin composition for semiconductor packaging and a semiconductor device using the same. The ingot epoxy resin composition includes: (i) The ingot epoxy resin composition includes a diameter of 0.1 mm to less than 2.8 mm and a height of 0.1 mm to less than 2.8 mm measured using the American Society for Testing and Materials standard sieve A plurality of ingots by weight% or greater than 97% by weight; (ii) the ingot-shaped epoxy resin composition satisfies Equation 1, wherein when measuring 50 ingots arbitrarily selected from these ingots, σD is the diameter of the ingot The standard deviation and σH is the standard deviation of the ingot height; and (iii) these ingots have a compressed density of 1.2 g / ml to 1.7 g / ml. |
| priorityDate |
2017-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |