| abstract |
An object of the present invention is to provide a curable resin composition which is excellent in flow characteristics before curing and which is excellent in adhesion after curing, heat resistance and bending resistance. Moreover, an object of the present invention is to provide a cured product of the curable resin composition and an adhesive, a film, a cover film, and a printed wiring board which are obtained by using the curable resin composition.n n n The curable resin composition of the present invention contains a thermosetting resin, a thermoplastic resin, and a quinone imine oligomer, and the quinone imine oligomer has a reactive functional group capable of reacting with the thermosetting resin. |