| abstract |
An object of the present invention is to provide an inorganic filler having a small average particle diameter or a large specific surface area, which is excellent in insulating film properties, and can maintain a dense bond with a conductor layer after an environmental test in a high-temperature and high-humidity environment. A resin composition of a cured product having a balance of properties. The solution is a resin composition comprising (A) an epoxy resin, (B) a hardener, (C) a polycarbonate resin, and (D) a resin composition of an inorganic filler, and (D) inorganic The filler has an average particle diameter of 100 nm or less. Or a resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) a polycarbonate resin, and (D) a resin composition of an inorganic filler, and (D) an inorganic filler. The specific surface area is 15 m 2 /g or more. |