| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a52af89e67b7b044f04d055c573de211 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-005 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-0427
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 |
| filingDate |
2018-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc5f8f336f2e87b7f909fcdf0e19a8ba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3dd9561e4044a87a1dbda5435d952b9e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f4c77e9ea7db7cb071eba0acae17ff1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc8d43d447bf8e0c90589378f2ecbed0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_edbfe8b42880f73b9c52753923ecf37d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0ae0655216f9134b528f431ff9f8863 |
| publicationDate |
2019-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201903039-A |
| titleOfInvention |
Curable resin composition, dry film, cured product, electronic parts, and printed wiring board |
| abstract |
The present invention provides a hardenable resin composition, which can obtain a hardened product that can maintain a low thermal expansion coefficient and have various properties such as toughness even in a high-temperature region when a component is mounted. The dry film and hardened product are used As well as electronic parts. The present invention is a curable resin composition containing a curable resin and a filler other than the fine powder and the fine powder having a size smaller than 100 nm at least once. The present invention uses a dry film, a cured product, and an electronic component of the curable resin composition. |
| priorityDate |
2017-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |