http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201901699-A

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filingDate 2018-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c31dc056b19800323a30103d57f8067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c0ebc54eed7fb3b4299e221b77d3f6c
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publicationDate 2019-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201901699-A
titleOfInvention Conductive composition
abstract An object of the present invention is to provide a conductive film composition having excellent solderability, screen printing, low electrical resistance, excellent adhesion to a substrate, and storage stability. The present invention is a conductive composition, which contains conductive particles, epoxy resin A having an epoxy equivalent weight of less than 500 g / eq and being liquid at 25 ° C, and an epoxy equivalent weight of not less than 400 g / eq and 5000 g / eq. The epoxy resin B, the thermoplastic resin C, the hardening agent D, and the solvent having a weight average molecular weight of 25,000 to 65,000 at a solid temperature at 25 ° C, and the A, the B, and the C described above with respect to 100 parts by mass of the conductive particles And the total amount of the D is 3 mass parts or more and 10 mass parts or less, and the mass ratio [(A + B) / C] of the total amount of the A and the B to the content of the C is 50/50 to 95/5 The mass ratio [A / (B + C)] of the content of the above A to the total of the above B and the above C is 15/85 to 85/15, and the mass of the above D relative to the total of the above A and the above B The ratio [D / (A + B)] is 2/98 to 10/90, and the conductive composition does not substantially contain a carboxylic acid metal salt.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I743683-B
priorityDate 2017-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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