| abstract |
The present invention provides a polishing composition, which is a polishing composition for polishing a silicon wafer, and is characterized by containing a water-soluble polymer and water, and the water-soluble polymer satisfies the following conditions: SP containing no hydroxyl group The repeating unit whose value does not reach 14.5, the amount of hydroxyl groups is 4 mmol / g or more and 21 mmol / g or less, and is nonionic. In addition, the present invention provides a method for polishing a silicon wafer, comprising: preparing a polishing liquid containing the aforementioned polishing composition; supplying the aforementioned polishing liquid to a silicon wafer as a polishing object; The polishing liquid polishes the surface of the polishing object made of silicon. . |