| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-324
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-00 |
| filingDate |
2018-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6676acb826e82e48899dd73b5e127908
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ff5b720860e15a6d3421818795d808b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ae99e095f5d0095cb642325fd13c1ce2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06ddc2bc54cc2acd41d3a6c276646811 |
| publicationDate |
2018-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201843751-A |
| titleOfInvention |
Semiconductor device and method of manufacturing same |
| abstract |
A method for manufacturing a semiconductor device, comprising: passing a first member having a connecting portion and a second member having a connecting portion through an adhesive at a temperature lower than a melting point of the connecting portion of the first member and a melting point of the connecting portion of the second member; A step of temporarily crimping at a temperature of 50 ° C. to obtain a temporary crimping body in which the connecting portion of the first member and the connecting portion of the second member face each other; and while pressing the temporary crimping body with air pressure, A step of heating the temperature of at least one of the connection portion of the first member connection portion or the connection portion of the second member to a temperature equal to or higher than the melting point of the connection portion arranged to be electrically connected to each other, the first member It is a semiconductor wafer or a semiconductor wafer, and the second component is a printed circuit board, a semiconductor wafer, or a semiconductor wafer. |
| priorityDate |
2017-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |