| abstract |
An object of the present invention is to provide a composition for cleaning a semiconductor substrate, which can efficiently remove minute particles on the surface of a substrate, and can easily remove a formed film from the surface of the substrate. The composition for cleaning a semiconductor substrate of the present invention contains a novolac resin, an organic acid that is not a polymer, and a solvent, and has a solid content concentration of 20% by mass or less. The organic acid may be a carboxylic acid. The carboxylic acid may be a monocarboxylic acid, a polycarboxylic acid, or a combination of these. The molecular weight of the organic acid is preferably 50 or more and 500 or less. The content of the organic acid with respect to 10 parts by mass of the novolac resin is preferably 0.001 part by mass or more and 10 parts by mass or less. The solvent may be an ether-based solvent, an alcohol-based solvent, or a combination thereof. The content ratio of the ether-based solvent, the alcohol-based solvent, or a combination thereof in the solvent is preferably 50% by mass or more. |