| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53242
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53257
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53214
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76807
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53228 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76826
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28562
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76814
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2018-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9fcdf7a4d29200b9b6500d5d95f80660
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7f66566275fc8d62604bab776a1ccb5a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0680cbd6529ed20f88e1984ec07accca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ff041d7ac296c6cdab1022709164bc8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f58822eeb798b64661ca705e323e6d4a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1468acad0639dea573cee9c4840316cd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b003046ebb6dfe5b899c9e7c9c3fe70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_48cc8275e8b8157da1cd86fe43978e0d |
| publicationDate |
2018-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201842626-A |
| titleOfInvention |
Process integration method for selective tungsten via filling |
| abstract |
The present invention generally relates to interconnects disposed on a substrate and methods of forming such interconnects. Through holes and trenches are formed in the stack formed on the substrate. The bottom of the via is pretreated using a first pre-treatment step. The sidewall of the via is pretreated using a second pretreatment step. A first type of first metal fill material of the first type is deposited on the stack and in the via. A second type of second metal fill material is deposited on the stack and in the trench. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11239164-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112349594-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112349594-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I757046-B |
| priorityDate |
2017-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |