| abstract |
The present invention provides a resin material that can effectively improve insulation and thermal conductivity, can effectively suppress unevenness in dielectric breakdown strength, and can effectively improve adhesion. The resin material of the present invention contains the first inorganic particles, the second inorganic particles, and the binder resin, and the aspect ratio of the primary particles constituting the first inorganic particles is 7 or more, and the aspect ratio of the primary particles constituting the second inorganic particles Less than 7, the compressive strength when the first inorganic particles are compressed by 10% and the compressive strength when the second inorganic particles are compressed by 10% are 2 N / mm 2 or less. |