http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201840625-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-14 |
| filingDate | 2018-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2643ced3e26d20e35c65456987ff0b36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9286d172ba1bdb81c54c098e573da0b6 |
| publicationDate | 2018-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201840625-A |
| titleOfInvention | Resin material for acid group-containing (meth) acrylate resin and solder resist |
| abstract | The present invention provides an acid group-containing (meth) acrylate resin which is required as an epoxy resin (A), an unsaturated monocarboxylic acid or a derivative thereof (B), and a polycarboxylic acid anhydride (C). The acid group-containing (meth) acrylate resin of the reaction material, wherein the epoxy resin (A) has an ester bond site derived from a polycarboxylic acid or a derivative (a1) in a molecular structure. The (meth) acrylate resin containing an acid group can form a cured product excellent in a balance between elongation and heat resistance. |
| priorityDate | 2017-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 129.