| abstract |
The invention provides a cleaning liquid composition which does not cause damage to SiO 2 , Si 3 N 4 and Si etc. used for forming a layer on the surface of a substrate when cleaning the surface of a semiconductor substrate or a glass substrate, and can be applied It is used under the processing conditions of scrubbing the cleaning chamber with a brush equipped with a CMP device, and has a high removability of compounds derived from abrasive particles in the slurry. The cleaning liquid composition of the present invention is used to clean the surface of a semiconductor substrate or a glass substrate, which contains: one or more inorganic acids or salts containing fluorine atoms in the structure; water; one or 2 or more reducing agents; and, 1 or 2 or more anionic surfactants; and, the hydrogen ion concentration index, that is, the pH value is less than 7. |