| abstract |
The present invention describes a method for removing edge beads on a wafer associated with a photoresist coating that includes a metal-containing photoresist composition. The methods may include: after spin coating the wafer with the metal-based photoresist composition, applying a first bead edge rinse solution along the edge of the wafer, wherein the edge bead solution includes an organic solvent and an additive, and the additive includes carboxy Acids, inorganic fluorinated acids, tetraalkylammonium compounds or mixtures thereof. Alternatively or additionally, the methods may include applying the protective composition to the wafer before performing edge bead rinse. The protective composition may be a sacrificial material or an anti-adhesion material, and in the case of a protective composition, it may be applied only to the edge of the wafer or across the entire wafer. Corresponding devices that use these methods to process wafers are also proposed. |