| abstract |
The epoxy resin composition contains a monofunctional epoxy compound having one epoxy group in one molecule, a polyfunctional epoxy compound having two or more epoxy groups in one molecule, and a hardener. The curable resin composition contains a curable resin, a curing agent, and a compound having a (meth) acrylfluorenyl group. The electronic component device includes an element sealed with an epoxy resin composition or a curable resin composition. |