| abstract |
The present invention provides a photosensitive resin composition having a small warpage of a cured cured film and excellent lithography during pattern formation, a method for producing a cured film, a laminate, a cured film, and a semiconductor device. The photosensitive resin composition includes: a polyimide precursor including a repeating unit including a biphenyl structure; and a photopolymerization initiator having an oxime structure capable of generating an aryl radical by irradiating light. |