| abstract |
The curable aqueous resin emulsion composition of the present invention contains 100 parts by mass of a (meth) acrylate-based epoxy resin (a), 1 to 200 parts by mass of a polymerizable unsaturated monomer (b), and a hardening accelerator (c ) 0.1 to 10 parts by mass, 1 to 50 parts by mass of the reactive surfactant (d), 10 to 2000 parts by mass of water (e), a radical polymerization initiator (f), and the following component (g) and components (h) at least one of: (g) at least one selected from inorganic particles and organic particles; (h) from alkoxysilane compounds, metal alkoxy compounds, metal clamp compounds, epoxy compounds, isocyanate compounds, three At least one compound selected from the group of azine compounds. |