| abstract |
The present invention provides a composition for a hardened resin which can simultaneously achieve properties of hardened materials such as high heat resistance and rapid hardening properties, and a method for hardening the hardened material and a composition for a hardened resin. In addition, a semiconductor device using the composition for a hardened resin as a sealing material is provided. This composition for hardening resin contains (A) a polyfunctional benzoxazine compound having at least two benzoxazine rings, and (B) a compound having at least one norbornane structure and at least two epoxy groups. The polyfunctional epoxy compound, (C) a curing agent, and (D) a phosphorus-containing curing accelerator, and may optionally contain (E) an inorganic filler. In addition, this semiconductor device is provided with a semiconductor element in a hardened material which hardens a composition for a hardening resin containing the components (A) to (E). |