Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_11d738aa9b5b691f2f5094e7b819ac93 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1436 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1454 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31051 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1409 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B1-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
filingDate |
2018-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc2c28e8f38e37ccef1840c52649140f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0ff7c3cb20e5827ad1509e667b0e7ec http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe1f51e90dc2eca1cca6968feb57b3e4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7645bf1696a59682ec331e10210366c0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6d22c6cd1fc149e13629141be87b0a6 |
publicationDate |
2018-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-201833292-A |
titleOfInvention |
Chemical mechanical planarization of films containing elemental bismuth |
abstract |
A chemical mechanical planarization (CMP) polishing composition includes an abrasive particle and an additive that pushes a removal rate of a film containing elemental silicon such as polycrystalline silicon and silicon-germanium. |
priorityDate |
2017-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |